期刊文献+

基于Star-ccm+的某水冷电机控制器热仿真及分析 被引量:13

Thermal Simulation and Analysis of a Water-Cooled Motor Controller Based on Star-ccm +
下载PDF
导出
摘要 为提高电机控制器的冷却效率,以一款60 k W水冷电机控制器为研究对象,采用有限元方法建立了电机控制器的散热模型,为消除不同网格尺寸对仿真结果产生的误差对其进行网格无关性验证,并利用CFD软件进行仿真,分析了水道内不同高度、不同形状的扰流块对控制器散热性能的影响。仿真结果表明:在满足工艺要求和总压降的条件下,采用高度为0.7 mm的菱形扰流块时,控制器散热效果达到最佳,这为控制器水道的选型提供了参考依据,具有工程实际参考价值。 In order to improve the cooling efficiency of the motor controller,a 60 k W water-cooled motor controller is taken as the research object. The heat dissipation model of the motor controller is established by the finite element method to eliminate the error caused by different mesh sizes on simulation results,and verifies grid independence. The influence of the different height and shape of the block on the heat dissipation of the controller is analyzed by using the CFD software. The simulation results show that,under the condition of meeting the requirements of the process and thetotal pressure,the heat dissipation effect of the controller is best when using a rhombus block with a height of 0. 7 mm,which provides a reference for the selection of the controller waterway,and has great practical value in engineering research.
作者 赖晨光 吕宝 陈祎 胡博 LAI Chenguang;LYU Bao;CHEN Yi;HU Bo(Key Laboratory of Advanced Manufacturing Technology for Automobile Parts,Ministry of Education,Chongqing University of Technology,Chongqing 400054,China)
出处 《重庆理工大学学报(自然科学)》 CAS 北大核心 2018年第8期8-13,共6页 Journal of Chongqing University of Technology:Natural Science
基金 国家自然科学基金资助项目(51305477) 重庆市重点产业共性关键技术创新专项(cstc2015zdcyztzx60011) the Collaborative Research Project of the Institute of Fluid Science Tohoku University Japan
关键词 电机控制器 网格无关性 水道扰流块 数值模拟 motor controller grid independence channel spoiler numerical simulation
  • 相关文献

参考文献4

二级参考文献37

  • 1李永东.高性能大容量交流电机调速技术的现状及展望[J].电工技术学报,2005,20(2):1-10. 被引量:48
  • 2徐德好.微通道液冷冷板设计与优化[J].电子机械工程,2006,22(2):14-18. 被引量:24
  • 3THOMAS B, DONALD G H. Optimal pulse width modulation for three-level inverters[J]. IEEE Trans. Power. Elec., 2001, 20(1): 41-47.
  • 4HEFNER A R. A dynamic electro-thermal model for the IGBT[J]. IEEE Trans. lnd. Applicat., 1994, 30(2): 394- 405.
  • 5CHAN Suyun, PAOLO M, MAURO C, et al. Thermal component model for electrothermal analysis of IGBT module systems[J]. IEEE Trans. Advanced Packing, 2001, 24(3): 401-406.
  • 6RAEL S, SCHAEFFER C, PERRET R. Electrothermal characterization of IGBT[C]// Proceeding of IEEE- IAS'94, Denver, CO, Oct.2-5,1994:1 336-1 343.
  • 7KEVIN A M, YOGENDRA K J, GERHARD H S. Thermal characterization of a liquid cooled AISiC base plate with integral pin fins[J]. IEEE Trans. Comp. Packaging Technol., 2001, 24(2): 3-10.
  • 8KNIGHT R W, HALL D J, GOODLING J S, et al. Heat sink optimization with application to microchannels[J]. IEEE Trans. Comp. Hybrids Manufact. Technol., 1992, 15(5): 832-842.
  • 9LUC Meysenc, LUCAS Saludjian, ALAIN Brieard. A high heat flux IGBT micro exchanger setup[J]. IEEE Trans. Comp. Hybrids Manufaet. Technol., 1997, 20(3). 334-341.
  • 10CHARLOTTE G, CHRISTIAN S. Integrated micro heat sink for power multichip module[J]. IEEE Trans. Ind. Applicat., 2000, 36(1): 217-221.

共引文献70

同被引文献112

引证文献13

二级引证文献36

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部