高速PCB设计中的阻抗匹配与方式研究

Research on Impedance Matching and Mode in High Speed PCB Design

在PCB的设计过程中,阻抗匹配的处理关系到信号的质量好坏。因此,以高速PCB设计中存在的阻抗匹配问题为研究对象,通过分析高速PCB阻抗的产生原理,分别介绍了高频电路、低频电路中阻抗匹配的原则,论述了阻抗匹配常采用的串联或者并联电容的手段。最后,以具体实例分析了高频电路中阻抗匹配时选用串联或者并联匹配需要注意的适用原则,即串联匹配要靠近源,而并联匹配则需要靠近负载。

In the process of PCB design, the processing of impedance matching is related to the quality of the signal. In this paper, the problem of impedance matching existing in high-speed PCB design is studied. By analyzing the principle of high speed PCB impedance generation, the principle of impedance matching in high frequency circuits and then in low frequency circuits are introduced respectively. The methods of impedance matching in series or shunt capacitors are also discussed. Finally, a specific example is given to analyze the principle of matching the impedances in high-frequency circuits. It is necessary to pay attention to the applicable principle that the series matching should be close to the source, and the parallel matching needs to be close to the load.