摘要
埋嵌铜块印制电路板具有高导热性、高散热性和节省板面空间等特点,能有效解决大功率电子元器件的散热问题。本文从埋嵌铜块设计、叠层结构、关键生产工艺、产品相关检测和可靠性等方面研究与分析,系统阐述了埋嵌铜块印制电路板的设计和关键工序的制造方法。
Embedded copper block PCB has the characteristics of high thermal conductivity, high heat dissipation and saving panel space. It can effectively solve the heat dissipation problem of high-power electronic components. In this paper, the design of embedded copper block, laminated structure, key production technology, product related detection and reliability are studied and analyzed. The design of embedded copper block printed board and the manufacturing method of key process are systematically expounded.
出处
《印制电路信息》
2018年第9期47-51,共5页
Printed Circuit Information
基金
2016年广东省应用型科技研发专项资金项目(项目编号:2016B090930004)资助
关键词
埋嵌铜块
叠层结构
压合
散热
Embedded Copper Block
Laminated Structure
Compaction
Heat Dissipation
