微波印制板自动金丝楔焊工艺优化

The Optimization of Automatic Gold Wire Wedge Bonding Process for Microwave Printed Circuit Board

论述了自动金丝楔焊应用于复合微波印制板高密度互连存在的难点,包括印制板硬度低、填充孔位置和印制板键合面高度一致性差带来的楔焊困难。采取多阶段施加压力和超声来降低印制板低硬度的影响,精细化编程将楔焊点位置避开填充孔,筛选印制板高度中值作为基准,降低键合面高度一致性差的影响。同时定制了楔焊劈刀工具,实现了中心线间距不低于45μm的高精度楔焊,并应用到批量产品生产中。

The difficulties of automatic gold wire wedge bonding in high-density interconnection of composite microwave printed boards were discussed, including the difficulty of low hardness of printed boards, the poor consistency of the filling holes and the bonding surface height of printed boards. Multi-stage application of pressure and ultrasonic was implemented to reduce the impact of low substrate hardness, fine programming was designed to avoid the filling hole position of the wedge bonding point,and screening the median substrate height as the reference was applied to reduce the influence of the poor consistency of the bonding surface height,while the wedge-welding tool has been customized to achieve high-precision wedge bonding with a centerline space of not less than 45 μm and was applied to mass production.