压合凹陷造成短路的原因分析及改善

Analysis and Improvement of the Causes of Short Circuit Caused by Compression Depression

介绍了对细密线路PCB板一次合格率的改善工作,重点是压合凹陷造成的短路现象的最新研究进展。通过对中测缺陷问题进行分析,发现压合凹陷是重要的中测良率影响因素。对压合凹陷短路现象产生的主要原因(PP粉、纤维丝、涂膜剂及其他灰尘杂物)做了进一步分析,并提出改善办法,可以有效降低压合凹陷造成的短路不良,从而提高中测一次合格率。

In this paper, the improvement of the pass rate of PCB board has been introduced, and the key point is to introduce the latest research progress of short-circuit phenomenon caused by compression depression. By analyzing the defects of the intermediate test, it is found that compression depression is an important factor affecting the intermediate test yield. The main reasons（PP powder, fiber wire, coating agent and other dust and debris） for short-circuit caused by compression depression are further analyzed, and the improvement measures are proposed to reduce the short circuit defect caused by compression depression and to improve the passing rate.