基于三维数据建模的IGBT键合线健康监测方法

A Health Monitoring Method on Bond Wires Fatigue in IGBT Based on Three-dimensional Data Model

针对绝缘栅双极型晶体管(IGBT)功率模块键合线的可靠性问题,将IGBT功率模块建模方法与数据统计分析相结合,提出一种基于三维数据建模的IGBT功率模块键合线健康监测方法。根据模块的饱和压降、正向导通电流和结温三者之间的特定关系,绘制出饱和压降曲面。当IGBT功率模块键合线脱落时,饱和压降会增大,同时饱和压降曲面也会随之上升。实验结果显示,健康的IGBT功率模块和键合线脱落的IGBT功率模块在饱和压降曲面上具有很好的区分度,从而验证了这种监测方法的可行性。

For the reliability research of bond wires in insulated gate bipolar transistor（IGBT） modules,the model me- thods of IGBT is combined with the statistic analysis of data,and a health monitoring method on wire bonding faults in IGBT modules is proposed based on three-dimensional data model.According to the special relationship of on-state voltage drop,forward current and junction temperature of IGBT,the on-state voltage surface can be drawn.When the bond wires break,the on-state voltage increases and the on-state voltage surface rises.Also,the experimental resuhs show that the on-state voltage surfaces of healthy and unhealthy IGBT are obvious distinct,which verify the correct- ness and validity of the proposed method.