摘要
本文以半导体单晶抛光片清洗原理为入手点,结合铬、砷化镓、硅等半导体单晶抛光片污染物质来源,对半导体单晶抛光片清洗技术进行了简单的分析,以便为半导体单晶抛光片清洗效率的提升提供依据。
In this paper, based on the cleaning principle of semiconductor single crystal polishing tablet, combined with the source of chromium, gallium arsenide, silicon and other semiconductor single crystal polishing tablets, this paper makes a simple analysis on the cleaning technology of semiconductor single crystal polishing tablet, so as to provide the basis for improving the cleaning efficiency of semiconductor single crystal polishing tablet.
作者
张凇铭
Zhang Songming(Beijing North Huachang microelectronics equipment Co.,Ltd.,Beijing,102600)
出处
《电子测试》
2018年第18期129-129,131,共2页
Electronic Test
关键词
半导体
单晶抛光片
清洗技术
semiconductor
single crystal polished wafers
cleaning technology