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一种有源自偏置的Ku波段CMOS低噪声放大器 被引量:1

An Active Self-biased Ku-band CMOS Low Noise Amplifier
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摘要 基于源简并电感共源共栅结构,设计了1种有源自偏置低噪声放大器,既可消除偏置电路功耗,又能克服无源自偏置噪声较高的缺点;另外利用键合线作为高Q值电感元件,进一步降低噪声系数并减小芯片面积.所设计低噪声放大器采用TSMC 0.18μm CMOS工艺进行优化设计并流水制备.仿真结果表明,在12-16GHz频段内,噪声系数NF低于3.2 d B,输入3阶交调点IIP3为1.573 d Bm.研制芯片面积为540μm×360μm,在1.8 V电压下,消耗16 m A电流.结果表明芯片测试实现在12.2-15.5 GHz频段上,输入输出反射性能良好,正向增益S_(21)>6 d B,反向隔离度S_(12)<-32.5 d B. An active self-biased low noise amplifier(LNA) based on source inductance degeneration cascode structure is proposed, to eliminate the power consumption of bias circuit and overcome the noise induced by passive self-bias technique. Bond wire was utilized as high-quality inductor to realize further low noise and decrease chip area. The designed LNA was optimized and fabricated in TSMC 0.18 μm CMOS process with chip area of 540 μm×360 μm. Simulated noise figure(NF) below 3.2 d B, and inputreferred third-order intercept point(IIP3) of 1.573 d Bm are achieved in 12-16 GHz. Measured S21 above 6 d B, S11 below-10 d B, S22 below-9 d B, and S(12) of lower than-32.5 d B are realized in 12.2-15.5 GHz.
作者 钱江浩 谢生 毛陆虹 李海鸥 Qian Jianghao;Xie Sheng;Mao Luhong;Li Haiou(Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology,School of Microelectronics,Tianjin University,Tianjin 300072,China;Guangxi Key Laboratory of Precision Navigation Technology and Application,Guilin University of Electronics Technology,Guilin 541004,China)
出处 《南开大学学报(自然科学版)》 CAS CSCD 北大核心 2018年第4期68-72,共5页 Acta Scientiarum Naturalium Universitatis Nankaiensis
关键词 低噪声放大器 CMOS 共源共栅 有源自偏置技术 键合线电感 low noise amplifier CMOS cascode active self-bias technique bond-wire inductor
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  • 1Federico A, Paolo M, Roselli L, Roberto S. Modeling and Characterization of the Bonding-Wire Interconnection [J ].IEEE Transactions on Microwave Theory and Techniques, Jan 2001, Volume: 49:142-150.
  • 2Federico A, Paolo M, Roselli L, Roberto S. Multi-Wire Microstrip Interconnections: A Systematic Analysis for the Extraction of an Equivalent Circuit [c]//IEEE MTT-S int. Microwave Symp. Dig, vol. 3,Baltimore, MD,June 1998: 1929-1932.
  • 3Chuang J Y ,Tseng S P, Andrew Y J. Radio Frequency Characterization of Bonding Wire Interconnections in a Molded Chip[c]// Electronic Components and Technology Conference,2004: 392-399.
  • 4Lim J H, Kwon D H, Rieh J S, Kim SW, Hwang SW. RF Characterization and Modeling of Various Wire Bond Transitions[J]. IEEE Transactions on Advanced Packaging, 2005,Volume 28, Issue 4:772-778.
  • 5Qi X N, Yue C P, Amborg T, Soh H T , Yu Z P, Dutton R W, Sakai H. A Fast 3D Modeling Approach to Parasitics Extraction of Bonding Wires for RF Circuits[c]//International Electron Devices Meeting, 1998 :299-302.
  • 6Doerr I, Hwang L T, Sommer G, Oppermann H, Li L,Petras M, Korf S, Sahli Parameterized Models for a RF Chipto-Substrate Interconnect [c] // Electronic Components and Technology Conference, 2001:831-838.
  • 7Kim S, Neikirk D P. Compact Equivalent Circuit Model for the Skin Effect [J]. IEEE MTT-S International Microwave Symposium Digest, 1996 Volume 3:1815-1818.
  • 8Low Y L, Degani Y, Guinn K V, Dudderrar T D, Gregus J A, Frye R C. RF Flip-Module BGA package [J] . IEEE Transactions on Advanced Packaging, Volume 22, Issue 2,May 1999: 111-115.

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