基于有限元的埋入式光电PCB高温层压应力分析

Stress Analysis for High Temperature Lamination of Buried EOPCB Based on Finite Elements

对在传统PCB中实现光波导埋置结构进行了温度-应力耦合场有限元分析研究,以应对制造加工过程中高温高压对其可靠性的影响。详细介绍了埋入式光电PCB热力学有限元模型的建模过程与温度-应力场可靠性研究的基本原理。对埋入式光电PCB实例进行研究,分析在现有制造加工技术条件下温度和应力对其结构可靠性的影响。结果表明,现有埋入式光电PCB制造加工工艺中加载的温度与应力不会对其结构造成功能性破坏,证明了设计制造方案的可行性。

The temperature-stress coupling field’s finite element analysis of optical waveguide embedded structure implemented in traditional PCB was carried out to deal with the influence of high temperature and high pressure on the reliability of manufacturing process. The modeling process of the thermodynamic finite element model of the buried photoelectric PCB and the basic principle of the reliability study of the temperature-stress field were introduced in detail. The example of buried photoelectric PCB was studied to analyze the influence of the temperature and stress on the reliability of its structural under the existing manufacturing and processing technology conditions. The results show that the temperature and stress loaded in the existing manufacturing process of buried photoelectric PCB will not cause functional damage to the structures, which proves the feasibility and engineering significance of the design and manufacturing scheme.