摘要
提出使用万能材料试验机,配合专用杯突夹具,测量印制电路板行业中铜箔的延展性,以简化测试过程,提高测试结果的准确度和重复性。通过实验分析了负荷加载速度、试样润滑材料和模具夹具加紧压力等关键测试参数对铜箔样品杯突测试结果的影响,提出适合铜箔样品的杯突测试条件。
Use universal material tester with cut test fixture to test the ductility of copper foil and plated copper in PCB industry. It can provide higher accuracy and repeatability test result with more simple test process. The effect of loading speed, lubricate material and press of clamp on the test result is analyzed by experiments. A set of cup test parameter which is suitable for copper foil or plated copper sample is present.
作者
方军良
FANG Junliang(Shanghai Meadville Science & Technology Co.Ltd.,Shanghai 201613,China)
出处
《电子工艺技术》
2018年第5期253-258,共6页
Electronics Process Technology
关键词
铜箔
延展性
杯突测试
copper foil
ductility
cupping test