摘要
采用爆炸复合工艺制备出Cu/Al复合板材,通过光学显微镜观察研究了其界面结合特性,并利用显微硬度仪分析了界面附近硬度及界面附近的形变特点。结果表明:Cu/Al复合板材以波形结合界面为主,波形界面上存在部分锯齿状结构;界面上靠近铝侧出现熔区;爆炸复合后,Cu、Al侧平均显微硬度比母材分别提高了14.8HV、5.9HV,且Cu侧显微硬度从表面向界面呈递增趋势。
Cu/AI composite plates were prepared by explosive composite technology, and the interface characteristics were studied by optical microscope. The hardness and deformation characteristics near the interface were analyzed by micro-hardness tester. The results show that the Cu/AI composite plate is mainly composed of waveform binding interface, and some jagged structures exist on the waveform interface. The melt zone appears on the interface near the side of aluminum; After the explosion, the average micro-hardness of the Cu and AI sides increased by 14.8 HV and 5.9 HV respectively, and the micro-hardness of the Cu side increased from the surface to the interface.
作者
王乐
李琼
边旭来
朱荣强
邹见宾
李松元
WANG Le;LI Qiong;BIAN XU-lai;ZHU Rong-qiang;ZOU Jian-bin;LI Song-yuan(Shanxi Hongqi Industrial Explosive Group Co.,Ltd,Baoji Shanxi 721000)
出处
《天津化工》
CAS
2018年第5期23-24,共2页
Tianjin Chemical Industry
基金
2015GY170
2015GY181
2017ZKC04-91
关键词
爆炸复合
Cu/Al复合板材
界面
显微硬度
explosive recombination
Cu/AI composite plate
interface
micro-hardness