摘要
提出一种基于串行总线数据交互的芯片间及板间的总线交互结构数据通信解决方案,解决板上及板间数据传输的瓶颈问题,同时针对手持设备体积有限,散热困难等因素,设计一种利用高性能多核处理器和低功耗FPGA的平台结构,提出一种基于这种新型处理架构平台的水下远场频域三维成像算法。测试结果表明:该架构下的实时处理算法满足实时性要求。
Factors based on the serial bus data interaction between chips and between the boards the bus the interaction structure data communication scheme is proposed to solve the bottleneck problem of data transfer between the board and the board,for both the limited volume of handheld devices,cooling difficulties,design athe use of high-performance multi-core processor + low-power FPGA platform structure proposed underwater three-dimensional imaging of the far-field frequency domain algorithm based on the new processing architecture platform. Simulationtests show that the algorithm meet the real-time requirment.
作者
吴玉泉
黄勇
王朋
张春华
WU Yuquan;HUANG Yong;WANG Peng;ZHANG Chunhua(Engineering Center of Acoutice, Institute of Acoustics, Chinese Academy of Sciences, Beijing, 100190, China)
出处
《网络新媒体技术》
2018年第5期40-46,共7页
Network New Media Technology
基金
青年英才计划QNYC201803
关键词
串行总线
高性能多核DSP
低功耗FPGA
水下远场频域三维成像
手持设备
Serial Bus
High - Performance Multi - Core DSP
Low Power FPGA
Underwater Far Field Frequency Domain 3D Ima-ging
Handheld Devices