再流焊加载曲线设置对温度循环适应性研究

Study on the adaptability of reflowsolderingcurve setting to temperature cycling

对有铅/无铅以及混合双面组装电路板的再流焊温度曲线进行仿真分析,优化焊接工艺参数设置,并对贴/插装器件进行温度循环仿真试验。对组装电路板温度循环可靠性进行相关分析研究具体内容涉及:1)再流焊工艺仿真与分析有限元模型建立;2)焊接组件温度循环适应性及加载曲线分析。本文提供了一种新的再流焊加载曲线设置方法,基于热传递及热结构耦合理论对再流焊焊接工艺进行仿真;对热循环模型求解并取得了可靠性最高的工艺参数最优组合。

The reflow soldering temperature curve of lead / lead fi＇ee and mixed double sided assembly eireuit boards is simulated and analyzed. The welding parameters are optimized, and the temperature eyeling simulation test of the plug/ eartridge deviee is earried out. The eorrelation analysis of the temperature eyele reliability of the assembled eireuit board is earried out. The main eontents are as follows： a） reflow soldering proeess simulation and analysis finite element model establishment; b） temperature eyele adaptability and loading eurve analysis of welding eomponents. This paper provides a new method for setting up the load eurve of reflow soldering. Based on the theory of heat transfer and thermal strueture eoupling, the reflow soldering proeess is simulated, and the best eombination of proeess parameters is obtained by solving the thermal eyele model.