SPS制备金刚石/铜基复合材料的组织和性能

Microstructure and Properties of Diamond/Cu Composites Fabricated by Spark Plasma Sintering

采用放电等离子烧结(SPS)方法制备了低金刚石含量的金刚石/铜基复合材料,研究了金刚石含量对复合材料的致密度、热导率、抗拉强度和伸长率等的影响。结果表明,随着金刚石含量的增加,金刚石/铜基复合材料的致密度、热导率、力学性能都先增后减。当金刚石含量为1.0%时,复合材料的抗拉强度达到221.35 MPa;在金刚石含量为1.5%时致密度达到最大值;热导率和伸长率都是在金刚石含量为2.0%时达到最大值。金刚石/铜基复合材料的断裂机制主要是韧性断裂以及增强体界面剥离。

The diamond/Cu composites were fabricated by spark plasma sintering（SPS）.The effects of diamond particles on the relative density,thermal conductivity,tensile strength and elongation of the composites were analyzed.The results show that with the increase of diamond content,the relative density,thermal conductivity,tensile strength and elongation of the diamond/copper composites are increased firstly and then decreased.With the diamond content of 1.0%,the tensile strength of the composite can reach the maximum value of 221.35 MPa.The maximum density can be obtained with the diamond content of 1.5%,and the thermal conductivity and elongation reach the maximum value when the diamond content is 2.0%.The fractures of diamond/copper matrix composites are characterized by ductile fracture and interfacial debonding.