一种特殊盲孔底部残胶的原因分析

Analysis of a special smear at in bottom of blind hole

常见的盲孔底部残胶,往往由于激光钻孔参数不合理或表铜厚度异常、棕化颜色异常,导致盲孔底部树脂残留过多,正常除胶无法完全除去,对盲孔导电性能存在严重的开风险。但有一种特殊盲孔底部"残胶"并非单纯的残胶,不当的处理方法可能会带来更为严重的后果。本文对这一特殊现象进行分析与研究,防止类似问题发生。

Common smear at bottom of blind hole, is often due to the unreasonable laser parameters or surface copper thickness, or abnormal brown oxide color, which leads to excess resin residues at the bottom of the blind hole, which cannot be cleared away completely by normal dismear process. It has serious risk of open circuit. But there is the special smear at bottom of blind hole, which is not a simple resin and the improper treatment may lead to more serious consequences. This paper analyzes and studies this special phenomenon, in order to prevent such problem from happening again.