扇出型封装结构可靠性试验方法及验证

Reliability Test Methods and Verification of the Fan-Out Package

基于可靠性试验所用的菊花链测试结构,对所设计的扇出型封装结构进行了完整的菊花链芯片制造及后道组装工艺制造,并对不同批次、不同工艺参数条件下的封装样品进行电学测试表征、可靠性测试和失效样品分析。通过菊花链设计结构及超声波扫描显微镜（SAM）等工具,对失效样品进行失效定位分析,并通过扫描电子显微镜（SEM）和能量色散X射线光谱仪（EDX）等失效分析工具进行失效分析。通过对不同批次的样品进行通断电测试、可靠性预处理、可靠性试验和失效分析,总结不同工艺方法对封装整体结构翘曲、芯片偏移、金属层分层等失效模式的影响。为晶圆扇出型封装的整体封装结构设计、工艺流程搭建、封装材料选择等工作提供了指导意见。

Based on the daisy chain test structure used in the reliability test,a complete daisy chain chip fabrication and the post-assembly process were carried out for the fan-out package structure. The package samples with different batches and different process parameters were characterized by the electrical test,reliability test and failure sample analysis. Failure location analysis was carried out by the daisy chain design structure and scanning acoustic microscope（ SAM）,and the failure analysis was carried out by the scanning electron microscope（ SEM） and energy dispersive X-ray spectrometer（ EDX） and other failure analysis tools. Through the open/short test,reliability precondition,reliability test and failure analysis of different batches of samples,the effects of different process methods on the failure modes of the package such as warpage,chip offset and metal layer delamination were summarized. It provides a guidance for the package design, process development and material selection on wafer level fanout package.