我国环形金刚石线锯技术在创新中发展

The innovative development of looped diamond wire technology in China

近十年来,国产金刚石长线锯在单晶硅、多晶硅切片开方以及蓝宝石切片方面获得迅速发展,同时环形金刚石线锯也悄然紧隨其后,依靠线速度快,切割效率高,配套设备结构简单的独特优势,国内几家超硬材料工具企业大力投入,努力创新,并成功地应用到国产大型KDP晶体切割(切宽1000mm)、大型LBO晶体切割、多晶硅截断开方、蓝宝石薄片切割(切宽150～220mm)和各种靶材切割等诸多方面。尤其用于多晶硅截断的环线截断机,今年初已经小批量应用到江浙一带的代工厂中。切割量虽然不多,却初显在多晶硅、单晶硅贵重材料切割方面的独特优势。与其配套的线切割机也从单一的立式机发展到诸多品种。

In the past ten years, when the domestic long diamond saw was developed rapidly in the field of slicing silicon, poly-silicon, and sapphire, the research of looped diamond wire saw also has followed such development with advantages of the fast line speed, high cutting efficiency, and simple associated equipment. Several domestic superhard material tool enterprises made large investment and innovative development came： the looped diamond wire saw has been successfully applied to cutting the domestic large KDP crystal（cutting width 1000mm）, large LBO crystal, polysilicon prescribing, sapphire wafer （cutting width 150-220mm）, and various targets. In particular, the circular cut-off machine for cutting polysilicon has been on duty in some small manufacturers in Jiangsu and Zhejiang provinces since the beginning of this year. Although the cutting amount was not much, the saw shew some unique advantages on cutting precious materials of poly-silicon and mono-crystalline silicon. And the line cutting machine has also been designed from a single vertical machine structure to many varieties.