摘要
以高电子迁移率晶体管、异质结双极晶体管和微波/毫米波集成电路为例,介绍化合物半导体器件的特点、封装、测试及其应用。
Feature, packaging, test and application of compound semiconductor device are introduced based on high electron mobility transistor, heterojunction bipolar transistor and microwave/millimetre-wave integrated circuit(MMIC).
出处
《电子元器件应用》
2002年第9期60-62,共3页
Electronic Component & Device Applications
