军用裸芯片KGD筛选方法探讨

Research on KGD Screening Method for Military Bare Dies

军用SIP、MCM、混合IC等先进封装产品对裸芯片的需求日益增大,选用通过可靠性筛选后的KGD是确保最终产品成品率和可靠性的有效保障。基于现有的国内外标准、检测设备和检验环境,针对KGD获取方式中的分立形态裸芯片,通过对单个芯片进行临时夹具装载/卸载,开展电老炼和三温测试,建立分立裸芯片的KGD筛选方法和环境控制方法,使筛选后的裸芯片在技术指标和可靠性指标上达到封装成品的等级要求。对筛选后的合格产品进行可靠性验证,证明提出的KGD筛选方法可以获得满足用户使用要求的KGD产品。

The demand for bare dies in advanced packaging products such as military SIP, MCM and Hybrid ICs is increasing. KGD after reliability screening is used to ensure the final product yield and reliability. Based on the existing domestic and foreign standards, testing equipment and inspection environment, aiming at the discreet bare dies in the KGD acquisition metnod, through temporary fixture loading/unloading of individual chips, electric aging and three-temperature testing are conducted to establish discrete bare dies. The KGD screening method and the environmental control method enable the screened bare dies to meet the grade requirement of the packaged finished products in terms of technical indicators and reliability indicators. The reliability verification of the qualified products after screening was carried out to prove that the proposed KGD screening method can obtain KGD products that meet the requirements of users.