内置皮拉尼计的硅通孔圆片级MEMS真空封装研究

Research on Built-in Pilani Gauge Wafer Level MEMS Vacuum Packaging Based on TSV

针对现有的圆片级真空封装存在检测难、易泄漏等问题,提出了内置皮拉尼计的硅通孔圆片级MEMS真空封装方法。研制了用于圆片级真空封装导线互连的硅通孔,探讨了玻璃盖板与硅圆片之间阳极键合工艺与硅圆片与硅圆片之间的金硅共晶键合工艺,研制了用于检测封装壳体内部真空度的皮拉尼计;研制了内置皮拉尼计的4英寸硅通孔圆片级真空封装,研制了低温激活非蒸散型吸气剂。实验研究表明,该研究解决了长时间保持真空度的问题。

In order to solve the problems of difficult detection and easy leakage in wafer level vacuum packaging, a through silicon vias （TSV） wafer level MEMS vacuum packaging method with a built in Pi lani gauge was proposed. A through silicon vias for the wires interconnect of wafer level vacuum packaging was developed, the bonding process of the anode bonding between the glass cover plate and the silicon wa fer and the gold silicon eutectic bonding between silicon wafer and silicon wafer was developed and dis cussed, A Pilani gauge for detecting the vacuum degree inside the package was developed. A 4 inch TSV wafer level vacuum package with a built in Pilani gauge was developed. A low temperature activated non evaporative getter was developed. Test results show that the research can realize long time vacuum of wafer level vacuum packaging