PCB微钻不同金刚石涂层加工性能的研究

Research on Machining Properties of Different Diamond Coatings for PCB Micro Drills

本文讨论了在微钻加工PCB板时化学气相沉积(CVD)金刚石薄膜的优化问题。首先进行了微米金刚石(MCD)薄膜、纳米金刚石(NCD)薄膜、硬质合金与PCB板的摩擦实验,通过观察磨损后的表面形貌及对磨损区域的化学元素分析,对比研究不同类型薄膜与PCB板的摩擦磨损特性;随后对MCD涂层、NCD涂层、类金刚石(DLC)薄膜涂层以及未涂层刀具进行了钻削PCB板的实验,研究不同类型薄膜微钻时的工作寿命与钻孔质量,综合比较微钻切削性能并优化薄膜类型。得到了以下结论:摩擦试验表明NCD-PCB摩擦对的摩擦系数最低(0.35),PCB板去除率最高;微钻实验的对比发现NCD涂层微钻的切削性能优异。在加工PCB板时,NCD薄膜最适应PCB板复杂的加工特性,是PCB微钻优良的硬质涂层。

This article discusses the optimization of chemical vapor deposition（CVD） diamond films when micro-drilling PCB boards. First, friction tests of micro-diamond（MCD） film, nano-diamond（NCD） film, cemented carbide, and printed circuit board（PCB） are performed. From observing and comparing the surface morphology after wear as well as the chemical elements of the wear area, friction and wear characteristics of different types of films with PCBs are analyzed;subsequently, experiments on micro-drilled PCBs for MCD coatings, NCD coatings, diamond-like（DLC） thin-film coatings,and uncoated tools are conducted. Studying the working life and drilling quality of different types of thin film, so as to comprehensively compare the micro-drill cutting performance and to optimize the film type. The following conclusions are obtained： The friction test shows that the friction coefficient of the NCD-PCB friction pair is the lowest（0.35）, and the PCB board removal rate is the highest. The comparison of the micro drill experiment reveals that the NCD-coated micro drill has excellent cutting performance. When processing PCB boards, NCD film is the most suitable for the PCB board＇s complex processing characteristics. It is an optimized hard coating on PCB micro drills.