焊接压力对SIMP钢TLP扩散焊接头组织性能的影响

Effect of bonding pressure on microstructure and properties of TLP joint of SIMP steel

为研究焊接压力对接头组织性能的影响,以BNi_2与FeNiCrSiB非晶合金箔为中间层材料、氩气保护,在不同压力条件下对SIMP马氏体耐热钢进行瞬时液相扩散焊接,焊接温度为1 240℃、保温时间为200 s。结果表明:随压力由4MPa增加到6 MPa,焊缝宽度变窄、接头晶粒细化、接头强度提高,接头最高抗拉强度约为783 MPa;但焊接过程中施加的压力过大会引起母材较大变形,从而影响焊接质量。

TLP bonding of SIMP steel was carried out by using BNi_2 and FeNiCrSiB amorphous alloy foils as the interlayers under different bonding pressure and argon protection atmosphere,and the welding temperature is 1240 ℃ and holding time is 200 s.The results show that with the pressure increasing from 4 MPa to 6 MPa,the bonding seam becomes narrower,the grain size of the joint is refined,and the strength of the joint is improved,and the joint has the highest tensile strength（about 783 MPa）. But excessive pressure during welding process can cause large deformation of base metal,which affects welding quality.