半导体行业镀膜用高纯银的制备方法及展望

The Preparation Method and Expectation of High Purity Silver for Coating of Semiconductor Industry

高纯银广泛应用于半导体领域,通过制成靶材或蒸发源材料,采用溅射或蒸镀工艺沉积于基体表面。银的纯度对镀膜的质量影响非常大,随着半导体集成电路领域的飞速发展,对镀膜中所使用的高纯银材料纯度提出了更高的要求,必须达到99. 999%以上。介绍了高纯银的制备方法,综述了国内外高纯银制备的研究现状,分析了存在的问题,并提出了今后高纯银制备的研究方向。

High purity silver widely used in semiconductor field,which can deposit on the substrate surface by sputtering or evaporation process by making as the target material or evaporation source material. The purity of silver has a great influence on the quality ofcoating,with the rapid development of the field of semiconductor integrated circuits field,the purity of silver is requested to reach more than99 999%. This paper introduces the preparation methods of high purity silver at home and abroad,analyzes the existing problems,and putsforward the future research direction.