有机载体对石墨烯-铜复合浆料性能的影响

Influence of organic carrier on the property of copper composite paste

为提高铜浆的导电性,选用松油醇-乙基纤维素系列有机载体,粒径为10μm的铜粉为主导电相,添加少量石墨烯为导电增强相,熔点为430℃的玻璃粉为粘结剂,按一定质量分数配合比混合制备石墨烯-铜复合浆料。并利用四探针测试仪、扫描电子显微镜(SEM)等分析测试研究有机载体对石墨烯-铜复合浆料性能的影响。结果表明:乙基纤维素、松油醇、消泡剂、硅烷偶联剂、乙酸乙酯的质量分数配合比为4.75∶82.18∶2.57∶5.37∶5.13条件下制得的有机载体性能较好;有机载体用量为20%(wt,质量分数)条件下,制得的石墨烯-铜复合浆料在丝网印刷过程中能够获得平整的印刷结构,具有较小的电阻率,为17.14mΩ·cm;添加少量石墨烯后复合铜浆电阻率比纯铜浆料降低了50.22%。

To improve the conductivity of copper paste,the 10μm copper powders as the main conductive phase were proportionally mixed with a small amount of graphene as the conductive reinforced phase,glass powders of 430℃and the terpineol-ethocel organic carrier.The influences of organic carrier on paste were characterized by Four-Point probe,scanning electron microscopy（SEM）and other testing methods.The results showed that the organic carrier had a better property when the mass fraction of ethocel,defoamer,terpineol,silane coupling agent and acetic ether of 4.75∶82.18∶2.57∶5.37∶5.13.The paste with 20 wt% organic carrier obtained a flat structure by screen printing.The paste with 20 wt% organic carrier had a smaller resistivity of 17.14 mΩ·cm.The resistivity of paste with a small amount of graphene was decreased by 50.22% compared to the copper paste.