摘要
Recently, we developed a nonbuckling interconnect design that provides an effective approach to simultaneously achieving high elastic stretchability, easiness for encapsulation, and high electric performance for stretchable electronics. This paper aims to systematically study its mechanical and electric behaviors, including comparisons of the nonbuckling and buckling interconnect designs on stretchability, effects of the thickness on electric performance, and modeling and experimental investigations on the finite deformation mechanics. It is found that the results on stretchability depend on the layouts. Long straight segments and small arc radii for nonbuckling interconnects yield an enhancement of stretchability, which is much better than that of buckling designs. On the other hand, shorter straight segments or thicker interconnects are better to lower the resistances of interconnects.Therefore, optimization of the designs needs to balance the requirements of both the mechanical and electric performances. The finite deformation of interconnects during stretching is analyzed. The established analytic model is well validated by both the finite element modeling and experimental investigations. This work is key for providing the design guidelines for nonbucklingbased stretchable electronics.
Recently, we developed a nonbuckling interconnect design that provides an effective approach to simultaneously achieving high elastic stretchability, easiness for encapsulation, and high electric performance for stretchable electronics. This paper aims to systematically study its mechanical and electric behaviors, including comparisons of the nonbuckling and buckling interconnect designs on stretchability, effects of the thickness on electric performance, and modeling and experimental investigations on the finite deformation mechanics. It is found that the results on stretchability depend on the layouts. Long straight segments and small arc radii for nonbuckling interconnects yield an enhancement of stretchability, which is much better than that of buckling designs. On the other hand, shorter straight segments or thicker interconnects are better to lower the resistances of interconnects. Therefore, optimization of the designs needs to balance the requirements of both the mechanical and electric performances. The finite deformation of interconnects during stretching is analyzed. The established analytic model is well validated by both the finite element modeling and experimental investigations. This work is key for providing the design guidelines for nonbuckling-based stretchable electronics.
基金
supported by the National Natural Science Foundation of China(Grant Nos.11572323,11772331,11302038,51365013,and 11732004)
the Chinese Academy of Sciences via the "Hundred Talent Program"
the Strategic Priority Research Program of the Chinese Academy of Sciences(Grant No.XDB22040501)
the State Key Laboratory of Structural Analysis for Industrial Equipment,Dalian University of Technology(Grant No.GZ1603)
the State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University of Science and Technology(Grant No.DMETKF2017008)
the Young Elite Scientists Sponsorship Program by CAST(Grant No.2015QNRC001)
the Opening Fund of State Key Laboratory of Nonlinear Mechanics
the Personnel Training Plan of Tianjin City in China for the Key Young and Middle-Aged Innovation Talents
the National Key Research and Development Plan(Grant Nos.2016YFB0201600,2016YFB0201601,2017YFB0202800,and 2017YFB0202802)
the Program for Changjiang Scholars,Innovative Research Team in University(PCSIRT)
the 111 Project(Grant No.B14013)
