TiB_2化学镀铜对微波烧结TiB_2/Cu复合材料性能的影响

Effects of Electroless Copper Plating of Pre-oxidation TiB_2 on Properties of TiB_2/Cu Composites Fabricated by Microwave Sintering

应用TiB_2预氧化的化学镀铜方法对TiB_2表面进行镀铜,通过微波烧结制备了TiB_2镀铜前后的TiB_2/Cu试样。应用扫描电镜(SEM)观察了TiB_2镀铜形貌,并考察了镀铜TiB_2及其含量对微波烧结TiB_2/Cu材料致密度、电导率和热膨胀性能的影响。结果表明,通过TiB_2预氧化实现了TiB_2表面镀铜,且镀铜效果较好;在TiB_2相同含量条件下,镀铜后试样的电导率明显提高,并随着TiB_2含量的增加提高幅度增大,但致密度稍有下降。同时,镀铜后TiB_2/Cu试样的热膨胀系数明显降低。热膨胀理论模型计算结果表明,TiB_2未镀铜时试样的膨胀系数与ROM模型计算值相符合,而镀铜的膨胀系数与Kerner模型计算值相吻合,这说明镀铜后能很好地改善TiB_2颗粒与基体的界面结合情况。

In order to improve interfaces bonding between the TiB2 particles and copper matrix,a new process of electroless copper plating on the TiB2 was put forward.The plating efficiencies of TiB2 were observed by SEM,and the relative densities,electric conductivities and thermal expansion properties of TiB2/Cu composites containing different volume fraction of TiB2 before and afetr coated copper fabricated by microwave sintering were investigated.The results show that the electrical conductivities and thermal expansivity properties of the samples with coated copper TiB2 are obviously superior to those of ones without coated TiB2,however,the relative density of the former is obviously lower than that of the later due to the characteristics of microwave sintering.The results of theoretical calculation reveal that the CTE of the TiB2/Cu composites without plating copper TiB2 is consistent with ROM model calculation value,while the CTE of the TiB2/Cu composites with plating copper TiB2 is consistent with Kerner model calculation value,which indicate that the interface of the TiB2 particles and the matrix is improved greatly after the TiB2 particles modified with plating copper.