印制电路板盲埋板设计与实现

Design and Implementation of Blind Buried Plate of PCB

一直以来传统的印制电路板使用通孔过孔将不同层的铜线导通起来形成通路。但是现今随着印制电路板向小型化、轻型化、高性能的发展,在很多方面已经无法使用通孔过孔来完成设计,这时采用一种非贯通孔的工艺来解决减小孔径、顶底互不干涉、减小过孔带来的stub影响等问题,需要使用盲埋这种新的印制电路板工艺来满足设计需求。

Traditionally,traditional printed circuit boards use through vias to connect copper wires of different layers to form vias.However,with the development of miniaturization,lightweight and high performance of printed circuit boards,it is no longer possible to design through hole vias in many aspects.At this moment,a non through hole process is needed to solve the problems of reducing the aperture,non interference between top and bottom layers,and reducing the stub effect brought by vias.The new printed circuit board process of blind buried vias is needed to meet the design requirements.