柱栅阵列试验方法研究

Research on the Test Method of CGA

陶瓷柱栅阵列是一种高密度、窄节距和大尺寸封装的器件。从系统整体组装的可靠性、封装工艺技术的匹配因素以及试验过程中可能遇到的各种实际问题出发,对陶瓷柱栅阵列器件的共面性、抗拉强度和剪切强度等3个方面的试验方法进行了研究,为陶瓷柱栅阵列器件检测方法的选择提供了一定的参考。

CCGA is a high-density, narrow-pitch, large-size packaging device. Based on the reliability of the whole assembly of the system, the matching factors of the packaging technology and various problems that may be encountered in the test process, the test methods for the three aspects of coplanarity, tensile strength and shear strength the of CCGA devices are studied, which provides a certain reference for the selection of detection methods for CCGA devices.