晶圆激光划片技术简析

Laser Dicing Technique Analysis for Wafer

针对晶圆划片工艺,分析了激光半划、激光全划、激光隐形划切和异形芯片的划切等工艺方法的特点。结合典型试验案例,提供了每种划片方式的适用领域,对晶圆划片具有一定的工艺参考价值。

Aiming at wafer dicing technics, this paper analyzes technics characteristic of laser half-dicing, laser full-dicing and laser stealth dicing. Fall together some typical test cases, provides the appropriate application field of each dicing method. It may be of reference value to wafer dicing.