芯片带有涂覆胶塑封器件超声扫描检测方法研究

Research on Ultrasonic Scanning Detection Method for Chip Coated Plastic Encapsulation Device

对于常规塑封器件，超声扫描检测可以快速、便捷地发现器件中的分层、裂缝、空洞、粘接层等典型缺陷，但是随着器件制造业的不断发展，许多新型器件、新的封装、新工艺不断涌现，给超声扫描检测试验引入新的难题。针对芯片带有涂覆胶的这种工艺，在进行超声扫描检测时就很容易被芯片表面涂覆胶所产生的异常波形所误导，会将正常的合格器件误判为不合格。提出了一种声扫、X光、剖面检测相结合的综合检测方式，有效解决了该类问题。

For conventional plastic sealing device, ultrasonic scanning detection can quickly and conveniently detect typical defect such as delamination ,crack,cavity and adhesive layer in the device ,the process of coating the chip with coating glue ,it is very easy to be misled by the abnormal waveform produced by the adhesive on the chip surface when conducting ultrasonic scanning detection, it is possible to misjudge normal qualified devices as unqualified,to solve this problem,a comprehensive detection method combining acoustic scanning, X-ray and sectionl inspection is proposed in this oaoer.