扫描超声显微镜检查在塑封集成电路检测中的应用

The Application of Scanning Acoustic Microscope Inspect in PEM Test

进口工业级塑封集成电路在军用武器装备中的使用范围越来越广泛，随之也出现了一些问题，如塑封集成电路内部易进入水汽产生界面分层、模塑工艺过程中留下的空洞等。为满足高可靠性应用环境的需求，需要使用非破坏性的扫描超声显微镜检查技术来剔除存在缺陷的塑封器件。通过收集整理近几年塑封器件出现的失效情况，结合GJB4027A-2006中关于塑封集成电路扫描超声显微镜检查的相关检验条款，对重点关注的缺陷判据结合实际案例做了进一步的讨论，有助于提高后期判图的准确性。

As plastic encapsulation device is more and more widely used in military field, problem also comes with that. Such as the easy access of water vapor in the device interior leads to interfacial stratification, and voids produced in the plastic sealing process. To eliminate early defects in encapsulation device, non-destructive acoustic scanning microscopy techniques is applied. Failure condition of plastic encapsulation device in recent years was collected and encapsulated. Combining GJB 4027A-2006 fault criterion, emphasis on defects was described further, and in this way improving the accuracy of the later sentenced to figure.