激光增材制造钨铜复合材料

W-Cu Composite Prepared by Laser Additive Manufacturing

钨-铜(W-Cu)复合材料综合了W和Cu一系列优良特性,如高硬度、高强度、良好的热电性能、较低的热膨胀系数以及较强的抗电弧烧蚀性能等,在电子工业、军工国防、航空航天等领域有广阔的应用和发展前景。然而,采用传统的粉末冶金、熔渗法等制备方法难以制备出高致密、高性能且具有复杂结构的W-Cu复合材料。增材制造技术的出现为解决上述问题提供了难得的契机,本研究采用此技术制备W(25)Cu复合材料,通过优化激光功率和扫描速率等加工参数,获得最佳工艺参数组合。利用该组合工艺参数成型的W-Cu复合材料表面平整,密度为11.78 g·cm-3,显微硬度平均值达到320 HV,硬度分布较为平稳,层间结合良好,热膨胀系数为7.33×10-6·K-1,导热系数为56 W·m-1·K-1,性能较好,并且微观组织均匀。

Tungsten-copper（W-Cu） composite material combines a series of excellent properties of W and Cu, such as high hardness, high strength, good thermoelectric properties, low coefficient of thermal expansion, and strong arc erosion resistance, etc. In the industrial, military defense,aerospace and other fields, W-Cu composite has broad applications and development prospects.However, it is difficult to prepare high-density, high-performance and complex structures of W-Cu composites by conventional methods such as powder metallurgy and infiltration methods. The emergence of additive manufacturing technology has provided a rare opportunity to solve the above problems. In this paper, W25 Cu composites were prepared by using this method. By optimizing the laser power and scanning speed and other processing parameters, the best combination of process parameters was obtained. The W-Cu composite material, which was formed by this combined process parameters, has a smooth surface with a density of 11.78 g·cm-3 and an average microhardness of 320 HV. The hardness distribution is relatively stable and the interlayer bonding is good. Its thermal expansion coefficient is 7.33×10-6 K-1, with a thermal conductivity of 56 W·m-1·K-1, and good performance and uniform microstructure.