定向凝固多孔铜微通道热沉散热性能的优化研究

Optimization of Heat Sink and Heat Dissipation Performance of Lotus-type Porous Copper Microchannel with Unidirectional Solidification

利用定向凝固制备圆柱形气孔规则排列的藕状多孔铜热沉,通过实验和Flow simulation数值模拟系统研究了藕状多孔铜热沉的散热性能。结果表明,多孔铜热沉不仅具有很强的换热能力,可以满足大功率电子元器件的散热;同时,采用水为冷却介质,将具有不同孔径的藕状多孔铜沿孔长方向按孔径梯度排列成组合热沉,可以显著降低多孔铜热沉的温差,并且降低进出口压降。当体积流量为80 m L/s,孔径梯度为0.1 mm,与一体多孔铜热沉相比,4段拼接多孔铜热沉的温差降低55%,压降减小50%,换热系数基本保持不变。

Lotus-type porous copper with regular pore distribution was prepared by unidirectional solidification, the heat dissipation performance of the coupling porous copper heat sink was studied by experimental and Flow simulation. The results show that the heat sink of porous copper not only has strong heat transfer ability, but also can satisfy the heat dissipation of high-power electronic components. At the Same time, water is used as the cooling medium,to arrange the root-shaped porous copper with different pore sizes along the direction of hole length and into combined heat sink according to the gradient of pore size, which can significantly reduce the temperature difference of the heat sink of porous copper and reduce the pressure drop at the inlet and outlet. When the volume flow rate is 80 mL/s and the pore size gradient is 0.1 mm, compared with the lotus-type porous copper heat sink, the temperature difference of the 4-section spliced copper heat sink is reduced by 55%, the pressure drop is reduced by 50%, and the heat transfer coefficient is basically unchanged.