优化电性能测试对提高Over-Bonding检测能力的研究

The Study of Improve the Over-bonding Detectability by Final Testing

由于铜线的巨大成本优势以及键合工艺的不断改进,铜线引线键合已经逐渐成为半导体工艺的主流,但是由于铜线本身的物理化学特性,随之产生的焊球脱落(Lift Ball Bond,LBB)、过键合(Over-bonding)等失效模式也给业界带来了新的困扰。业界通过增加保护气体防止键合过程中铜球被氧化、优化键合步骤等措施已经能较好地控制LBB的产生。但是如何减少以及控制0ver-bonding目前还没有较好且统一的方法。所以如何在后期的电性能测试(ATE)过程中,通过优化测试参数以便更好的检测到Over-bonding就显得尤为重要了。本文以普通BJT(T0357)为例,介绍了一些针对测试参数的分析来检测Over-bonding的研究。

In current semiconductor assembly and testing process, Due to the huge cost advantage of copper wire and the continuous improvement of bonding process, copper wire has become the main material be used in wire bonding process. However, due to the physical and chemical properties of copper wire itself, the engineers often suffered the Lift Ball Bond, Over-bonding and other failure modes which were brought by copper wire bonding in daily work. Cur- rently the engineers can use the protective gas and also optimize the bonding parameters during WB process to prevent the LBB produced. But how to control the Over-bonding is still a problem for us. So in the followed final testing pro- cess, how to increase the Detectability for over-bonding is become more and more important. In this paper, the autor has done some analyse on this topie based on the BJT （ T0357 ）.