PCB板级电路中高效散热结构的优化设计

Optimized Design of Efficient Heat Dissipation Structure in PCB Board Level Circuit

印制电路板(PCB)厚度方向的导热系数比平面方向的导热系数小得多,为了改善板厚度方向的导热性能,提出了一种改进的自然对流冷却散热方式。首先,通过在PCB板中设计热过孔并在其背面安装散热器,应用热分析软件Icepak对散热模型进行仿真,优化设计散热器翅片的厚度和数目对功率器件温度分布的影响;然后,根据优化后的结果,选定最佳修正尺寸,制作测试结构;最后,采用热电偶法对其进行实验测试,结果表明此散热结构可有效降低器件的温度。

The thermal conductivity in the direction of the PCB thickness is much smaller than that the thermal conductivity in the plane direction.In order to improve the thermal conductivity in the thickness direction of the plate,an improved natural convection cooling method is presented.By designing the heat traverse in the PCB plate and installing the radiator on the back,the heat dissipation model was simulated by the thermal analysis software Icepak,and the influence of the thickness and the number of the fin of the radiator on the temperature distribution of the power device was optimized.According to the optimized results,the best correction size can be decided to make the test structure.Using thermocouple method to test the experiment,the results show that the cooling structure can effectively reduce the temperature of the device.