金刚石/Cu复合界面导热改性及其纳米化研究进展

Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites

金刚石/Cu复合材料以其高导热、低膨胀、耐热、耐蚀等优异特性,在热管理领域具有广泛的应用前景。但金刚石/Cu复合界面不相容限制了其性能水平。界面改性设计是改善界面结合、降低界面热阻的有效途径。本文以金刚石/Cu界面改性层的设计原理与主要因素为切入点,简述了金刚石/Cu复合材料界面设计的主要研究进展、存在的关键问题以及界面层厚小于200 nm的界面纳米化设计等几个方面的研究热点,并对其未来界面工程纳米化发展趋势予以展望。

Due to the superiority in high thermal conductivity, low thermal expansion and good resis- tance from heat and corrosion, diamond/Cu composites show great prospect in thermal management ap- plications. However, the thermal properties of diamond/Cu composites are impeded by their interface in- compatibility. Interface modification is an effective method to enhance interfacial bonding and reduce in- terfacial thermal resistance. Based on the principles and factors related with interface design, this paper briefly reviewed some hot topics in diamond/Cu composites, including the main research progress, is- sues remained to be solved and nanoscale interface design with layer thickness lower than 200 nm, and its prospect of the future development.