蚀刻添加剂对精细线路制作能力提升的研究

Improvement of fine line manufacturing by etching additive

终端电子产品的飞速发展对印制电路板产品的线路等级提出了更高的要求，因此提升精细线路产品的制作能力和成品良率对工厂至关重要。文章探讨了在传统减成法的基础上引入一种能直接添加到蚀刻液中的蚀刻添加剂（EA—X，Etching Additive—x），通过试验验证：当面铜厚度为17．20μm和21．24μm时，加入EA—X对线宽／线距为30／30μm、35／35μm和40／40μm精细线路制作能力的提升作用。试验结果表明：加入蚀刻添加剂后，精细线路的线宽制程能力指数明显提升、一次良率上升、蚀刻因子增大。使用面铜厚度为35μm的测试板进行蚀刻试验。发现该蚀刻添加剂的作用原理为加速纵向蚀刻的同时充当护岸剂减缓侧蚀。本论文为减成法精细线路制作提供有效的改善思路。

With the rapid development of electronics, higher demands were set on circuitry making of Printed Circuit Board （PCB）. Therefore, it＇s crucial for PCB manufacturer to find ways to improve their process capability and yield of fine line products. In this paper, an etching additive （EA-X） was introduced to subtractive process. Using 17-20μm or 21-24μm surface copper thickness board, some etching experiments were done to determine how the etching additive affect the 30μm, 35μm or 40μm fine lines etching. It＇s proved that the etching additive can obviously improve the Process Capability Index, yield etching factors of 30/30μm, 35/351xm and 40/40μm lines. The 35μm copper thickness etching experiment proved that the etching additive played the role of depth etching accelerant and banking agent at the same time. The results of this paper provide effective measures for subtractive process fine line making.