摘要
文章通过品质报废原因定位分析,确定层间对位的主要影响因素。通过制程能力监控、叠层设计优化和铆钉选择管控对层间对位能力进行改善,同时,借助X-Ray钻靶机建立信息化层偏数据库,适时进行统计过程控制(SPC)监控。有效管控层间偏位。
This paper identified the main influencing factors of interlayer contraposition through the causes of the quality defects. The interlayer contraposition ability was improved by optimization of Process capability monitoring, Stacking optimization, and Rivet control. At the same time, it established the database of interlayer contraposition by X-Ray target drilling machine. Timely Statistical Process Control, the interlayer contraposition were effectively controlled.
作者
廉泽阳
彭超
李艳国
Lian Zeyang;Peng Chao;Li Yanguo
出处
《印制电路信息》
2018年第A02期186-192,共7页
Printed Circuit Information
关键词
层间对位
管控优化
叠层优化
铆钉选取规则
统计过程控制
Interlayer Contraposition
Control Optimization
Stacking Optimization
Selection Of Rivet Rules
Statistical Process Control