激光钻偏要因初步分析

Primary analysis to the root cause of laser drilling deviation

激光钻偏一直以来为印制电路板业内长期存在的问题，目前已成为影响激光钻孔成品率最主要的因素。其产生不仅受激光钻孔本身的影响，还受其他多个制程的累加影响，且部分涉及对位系统问题，改善难度较大。本文针对激光钻偏的要因进行了初步的分析，结合大量三现分析的数据基础，总结出影响激光钻偏的最主要三大因素为图形变形、机台精度异常、人员操作异常．为后续改善提供初步的方向。

Laser drilling deviation is a problem existed in the PCB field for a long time. Now it becomes the most important cause for yield of laser drilling. It generated not only affected by laser drilling, by also by any other processes accumulatively. It is very hard to improve because of the registration system. This article makes a Primary analysis to the root cause of laser drilling deviation with a large amount of basic data analyzed. It makes a summary that the most major causes of laser drilling deviation are imaging shape change, laser drilling machine precision, human operation. It provides a primary direction for improvement.