高Tg180分段式印制电路插头加化镍浸金的制作研究

Research on the production of Tgl80 graded gold-plated finger board

文章提及到的一种关于Tg180分段式印制电路插头加化镍浸金的制作研究．其流程重点在于对除胶速率的研究以及分段式印制电路插头的制作和印制电路插头间引线的蚀刻，该产品主要运用在无人机领域，在印制电路制造行业，高频高速低介电常数材料应用于高端印制电路产品制作越来越多，该产品设计为双排印制电路镀金插头（分段式设计）其整板的表面处理为镀金加化镍浸金，镀金要求不低于0．75μm，化镍浸金不低于0．05μm，且其板材为Tg180的特殊材料，故文章在除胶工序中还延伸出研究不同板材的除胶速率，文章通过完整的制作流程总结了该类型的一个制作经验。

With the increasing development of electronic products, the application of PCB requirements is also gradually improved. This paper discussed about Tg180 sectional gold-plated fingers-gold plate production research. Its process is focused on the study of degumming rate and sectional gold-plated fingers making and gold-plated fingers fuses etching. The products are mainly used in the field of the process of unmanned aerial vehicle （uav）. The whole board of surface treatment for gold plated fingers-gold, gold- plated requires no less than 0.75μm, not less than 0.05μm of gold＂, and the plate for Tg180 special materials. This paper also extends the research in the degumming process of plate of different degumming rate. In this article, through the entire production process, it summarizes the type of production experience.