电镀铜晶核生长不均衡问题的研究

Analyzing the real reason of copper crystal nucleus unbalanced growth after electroplating

随着客户需求的不断变化，树脂塞孔的工艺流程在印制电路板产业的应用越来越广泛，但是经过陶瓷研磨后的印制电路板。电镀可能因为铜晶核生产不均衡出现铜粒、粗糙。文章以此为研究对象，简述产生的影响因素。并提出可行性建议，提供改善思路和方向。

The requirements of the customers are changing constantly. The resin plugging process is more and more widely used in PCB. But the surface of copper by the ceramic scrubbing will has crystal nucleus unbalanced growth after electroplating, and emerge some copper particle and roughness. This article summarizes the main influence of the copper particle and roughness and provides some suggestions for improvement.