无铅焊料锡须生长

Lead-free Solder＇s Tin Whiskers Growth

随着电子器件焊料转向无铅化，导致元器件不可避免的会受到无铅化焊料出现锡须生长，引发产品短路的风险。文章重点对锡须生长的过程展开研究．由生长机理解释锡须的生长特性。并由此提出了抑制锡须生长的几种方案。为印制电路板焊点锡须短路分析提供理论依据。

As the solder of electronic devices turns to lead-flee, it will inevitably lead to the risk of short circuit of products caused by the growth of tin whiskers caused by lead-flee solder. This paper focuses on the study of the growth process of tin whisker and explains the growth characteristics of tin whisker by the growth mechanism. Several methods to restrain the length of tin whisker are proposed, which can provide theoretical basis for the analysis of short circuit of tin whisker at PCB welding point.