数学模型用以提高印制电路板电镀参数准确性的研究

Research of using Mathematic model to improve plating parameter for PCB

文章通过匹配Tobin模型等计量模型与最优控制模型．计算不同铜厚要求的印制电路板的电流密度和电镀时间最优水平，进而建立各批印制电路板订单的电流密度和电镀时间的数学模型。并将该模型嵌入公司ERP系统。以提高电镀工作效率。同时达到降低生产成本的目的。

In this paper the Tobin model and optimum forecast controlling model are matched to calculate different plating parameter to match PCB with different copper thickness, so that to establish mathematic model to predict plating parameter of every order. This model will be embedded into company＇s ERP to improve efficiency and decrease cost at the same time.