与阻焊开窗等大的“D”字型异型焊盘PCB电测工艺研究

PCB electrical measurement technology for large ＂D＂ shaped pads with soldermask and window opening

PCB元件引脚采用与其形状相同、阻焊开窗尺寸等大的焊盘设计则可节省更多的空间。但制造过程中受设备精度、材料特性、工艺能力等影响均会导致焊盘偏位、尺寸缩小、可焊性变差、测试失效。文章将依据“D”字型异型焊盘的技术特点、对PCB制程中关键工序焊盘的制作精度及电测工艺展开研究，确保与阻焊等大的“D”字型异型焊盘PCB像常规方型或圆型焊盘PCB一样具有优良的电接触性能及焊接性能。

With the development of electronic products in the direction of high density, miniaturization and integration, the use of large pads, such as the shape of the same shape and the size of the resistance to the window, can save more space. The influence of the precision of the equipment, the material characteristics and the technological capability in the manufacturing process will lead to the deviation of the weld plate, the size and the weldability. According to the technical characteristics of the ＂D＂ type special-shaped welding pad, the paper will study the fabrication precision of the welding disc in the key process of the PCB process and the electrical measurement technology. It will ensure that the large ＂D＂ type special-shaped pads, such as the soldermask and so on, have the same excellent electrical contact and welding properties as the conventional square or circular plate PCB.