PCB介质层厚度测量方法说明

About the PCB layer-to-layer spacing testing method explanation

文章重点介绍了IPC相关标准中对PCB介质层厚度的公差要求、测量方法要求等．同时结合相关客户对PCB介质层厚度的要求与标准分析。说明其中可能会存在的一些理解误区。比如不同等级层压板材料公差与测量方法的区别。最小介质层厚度要求的理解，显微剖切法测量介厚的方法区别等。最终针对PCB介质层厚度的测量。也给出了一些建议，希望能让更多人理解IPC标准中的介质厚度要求与测量方法，更好的达成多方共识。

This paper focus on the tolerance requirements and measurement requirements for the thickness of the PCB layer-to-layer spacing in IPC standards. At the same time, it compares with the requirements of the PCB layer-to-layer spacing by the customers, explains the difference between customers such as the tolerance and measurement for the different classify CCL, the minimum thickness of the PCB layer-to layer spacing, the measurement by microsection method. And it gives some suggestions for the measurement of the thickness of the PCB layer-to-layer spacing. It is hoped there will be more and more people read it clearly and reach a better consensus.