有机可焊保焊膜（OSP）卤素含量的测定

Determination of halogen content in organic solder ability preservatives coating

继无铅制程后，无卤素绿色电子产业受到电子行业广泛关注。卤素主要包括氟（F）、氯（Cl）、溴（Br）、碘（I），被广泛应用于电子产品。卤素被列为会对人类健康和环境造成严重危害的化学品。因此卤素化合物禁止或限量使用。在RoHS（欧盟关于在电器电子设备中禁止使用某些有毒有害物质指集令）中明确规定溴、氯含量分别小于0．09％，且溴与氯的含量总和小于0．15％。文章重点介绍了目前几种应用于PCB板表面OSP膜卤素含量测定的方法——能谱分析（EDX）、X-射线荧光光谱分析（XRF）和离子色谱分析（IC）并对比其优缺点：同时．运用上述方法进行PCB板表面OSP膜卤素含量的测试并对结果进行了对比。明确各测试方法对测试结果的差异性，并按照Rohs法规对卤素含量的定义，建议表征PCB板上OSP膜卤素含量的最佳方法。

Following the lead-free process, the halogen-free electronics industry has been received extensive attention. Halogen mainly includes fluorine （F）, chlorine （C1）, bromine （Br）, and iodine （I） and is widely used in electronic products. It is well known that halogen can cause extremely harmful effect to human health and the environment, so the application of halogen compounds is prohibited or limited. The RollS clearly specifies that the content of CI and Br must be less than 900ppm respectively, in addition, the sum of C1 and Br content must be controlled below 1500ppm. This paper focuses on the methods, including Energy Dispersive X-Ray Spectroscopy （EDX）, X-ray Fluorescence Spectrometer （XRF） and Ion chromatography （IC）, used to determine the halogen content in the Organic Solderability Preservatives and the advantages and disadvantages of methods mentioned above. Meanwhile, the author has used these methods to determine the halogen content in OSP and defined the difference of test results in each method by comparing the results. According to the definition of halogen content in RollS regulations, the best method to characterize the halogen content on PCB board is suggested.