PCB金属化孔可靠性研究

Research on the reliability of PTH in PCB

航天印制板金属化孔的要求集中于孔内凹蚀量、孔铜微观结构、塞孔的可靠性等。文章分析了不同的凹蚀条件、不同的塞孔保护材料、不同孔铜微观结晶结构对金属化孔可靠性的影响，也探究了电测时不同开路判定电阻对孔铜裂纹检出情况的影响。确定了孔径大小对孔内凹蚀量的影响，界定了可靠的塞孔材料、孔铜微观结晶结构及最适的开路判定电阻值。本研究可为航天PCB的设计和制造提供依据。

The requirements of aerospace PCB are focused on the etchback of holes, the microstructures of PTH inner coppers, and the reliability of the plugged-holes. In this paper, a comprehensive study is conducted to analyze different impacts on the reliability which use different etchback conditions, different plug hole materials and different micro-crystallization of PTH inner holes, and the effects of the different set resistance of open circuit. The decision to examine hole copper is also been discussed. This study can provide basis for the designs and manufacture of aerospace PCB.