陶瓷基板通孔制作研究与成孔质量分析

Study on producing through holes of ceramic plate boards and through holes quality analysis

现今的LED电子产品正朝着高功率，高集成的方向发展，而小尺寸、高放热量的LED光源产品对PCB的散热性有很高的要求。陶瓷因具有高机械强度、高热导率、优良绝缘性和热膨胀系数等特点，正好迎合了LED电子产品的发展方向。满足高频、高散热PCB的性能需求。但传统PCB钻孔技术难以适用于高硬度、高脆性的陶瓷材料，因此陶瓷基板钻孔工艺需要重新分析与研究。文章将通过Al2O3基板的机械钻机制作通孔试验、A1203和AlN基板的CO2激光切割机制作通孔试验入手。从不同钻孔工艺参数、激光设备选用等方面实验变量。结合成品孔的孔径加工精度、孔口形貌、孔壁质量等实验结果。探讨生产陶瓷基PCB上通孔的工艺能力和可适用参数。为实现批量陶瓷基板通孔的制作打好基础。

With the development of high power and integrated direction of LED light source, the heatdissipation requirements of small size LED light resource electronic products become higher and higher. The ceramic materialhas high mechanical strength, high thermal conductivity, excellent insulation and suitable thermal expansioncoincident characteristics, which can meet the development trend of electronic products of LED and the high frequency, high heat dissipation print circuit board function requirements. But traditional drill technology of circuit board is not suitable for ceramic, which need more experiment and analyses. In this paper, by comparing different machine drilling and laser cutting equipment and parameter of Al2O3 and AlN subtracts drilling experiment and assessing the precision of aperture, it achieves the quality of through holes in Al2O3 and AlN subtracts produced by machine and CO2 laser. It measures the ability of forming through holes with applicable drilling parameter and accumulates foundation to achieve mass production of ceramic plate by the basic process.