摄像头刚挠结合板的平整度分析与研究

Study on rigid-flex board flatness of CMOS camera module

随着电子信息产品功能的不断强大。对刚挠结合电路板提出了更高的要求。特别是在移动通讯终端，大量使用摄像头，且像素越来越高。而应用于摄像头的刚挠结合板的平整度对像素影响极大。影响摄像头板平整度的工序众多且因素复杂，文章通过正交法对辅材敷型材料、基材结构、压合参数及其他工艺制程的影响因素进行了对比试验，找出影响平整度的关键因素。并通过优化制程参数。达到提高摄像头刚挠结合板的平整度，满足客户要求的目的。

With the development of electronic information products, there are more and more requirements for the rigid-flex board. Especially, more camera with high pixel are used in mobile communication terminal, and the flatness of rigid-flex board has a great influence on pixel. The processes and factors that effect pixel are complicated. This paper contrasted the assistant material, substrate structure, lamination parameter by orthogonal test, and figured out the key parameters. After optimizing the process parameters, the quality of flatness was increased which can satisfy the customer＇s requirements.