新一代高速印制电路板工艺控制

Process control research on High speed PCB of new platform

文章主要对新一代高速印制电路板的设计及材料特点进行汇总。并对加工过程中可能产生的部分失效进行汇总分析，包括对材料可靠性相关的层压参数控制，及连接器尺寸控制等进行阐述，从而提出一种层压可靠性可控的新一代高速印制电路板的设计及过程管控方法用于业界参考。

This paper focuses on the research of new platform high speed PCB lamination processing technology. It focuses on possible factors which will affect the quality of high speed PCB, including reliability performance after lamination and dimension control etc..and then makes a summary of how to avoid all of these issues.